Low temperature drying ovenProduct Usage:
Low temperature drying oven is mainly used for storing electronic components such as semiconductor devices, printed circuit boards, electronic components, liquid crystal glass substrates, optical films and lenses, quartz vibrators, and other foods in low temperature and low humidity.
Low temperature drying ovenScope of application:
Low temperature drying ovens are widely used in research and application fields such as biochemistry, chemical pharmaceuticals, medical and health care, agricultural research, environmental protection, etc. They are only used for powder drying, baking, and disinfection and sterilization of various glass containers. Low temperature drying oven is particularly suitable for fast and efficient drying of heat sensitive, easily decomposed, easily oxidized substances and complex components.
This type of low-temperature drying oven is a new product developed for manufacturers of LED optoelectronic components. The vacuum chamber is square in shape and has the following advantages compared to older low-temperature drying ovens:
1. The square vacuum chamber of the low-temperature drying oven can fully utilize the space.
2. Gently close the door, and the low-temperature drying oven door can automatically suck in and evacuate.
3. Increase the pumping rate and ensure that the vacuum degree of the low-temperature drying oven is greater than 760mm/Hg.
4. The vent valve is located in front of the box door, making it easy to extract and release air. This low-temperature drying oven is not only suitable for drying and vacuum processing of LED optoelectronic components, batteries, pharmaceuticals, and electronic components, but also for other product industries.
Low temperature drying oven:
Usage and precautions:
1. This type of oven should work indoors and be installed smoothly.
2. The power input should be equipped with a dedicated front-end on/off switch and properly grounded.
3. It is necessary to check the power supply, voltage, and power wiring before powering on for use.
4. When newly purchased or stored for a long time, it is recommended to first bake at a low temperature of 80-100 ℃ for two hours before starting to raise the temperature to facilitate moisture leakage, enhance insulation performance, and extend the life of the ceramic parts.
5. The thermal sensor probe for instrument temperature control should be inserted into the working chamber from the temperature measuring hole on the left side of the circuit, and should not be inserted from the center hole of the air valve on the top of the box to avoid affecting its use.
6. When using this oven for the first time, please observe it carefully to avoid overheating and damaging the workpiece, causing losses.
7. Take in the baking object: Do not hit the temperature controller part that extends into the studio to prevent damage to the temperature controller and malfunction.
8. Avoid baking explosive, flammable, and volatile materials in this box to prevent explosions.
9. If there is a malfunction, please have a professional electrician repair it.
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